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Discussion Starter · #1 ·
Of all the weird things I would do in my life. :eek: Something made me read the composition information about two different thermal pastes that are available at a local retailer here.

Both of them are "Arctic Cooling" products. One of them is composed of:
10% Silver / Copper
40% Silicon
30% Metal Oxide
20% Carbon

The second one is composed of:
25% Silver
30% Silicon
30% Metal Oxide
15% Carbon

Getting to the point ;) of my questions. Between these two Thermal pastes when used with a P4 3.0GHz processor which would be more effective. And what key features of these products should one use to decide which would be best suited for P4 processors and beyond.
 

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I would guess that the one with the higher silver content would be more efficient at heat transfer, but there may well be other issues like the ability to mould to the surfaces without micro cavities or bubbles. Are any figures offered regarding heat transfer or thermal resistance? If so go for the one with the lower equivalent thermal resistance.

And remember not to overdo it when you apply, more is not always more (as it were) :D.
 
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